The Pathway to 50% Footprint Reduction & Reduced Maintenance Upgrading from Electrical Mechanical Relays to High-Density MOSFET Relay Modules
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In the development of next-generation SoC test systems, ATE manufacturers face the critical requirement of doubling pin counts while maintaining the same physical footprint. Space on load boards and pin electronics cards has reached its physical limit, making further densification impossible with existing components. This recommendation outlines the strategic advantages of migrating to the Toward Technologies MOS Relay Modules. By replacing Electrical Mechanical Relays (EMRs) with PhotoMOS technology, manufacturers can achieve an approx. 50% reduction in PCB footprint while virtually eliminating relay maintenance costs caused by mechanical contact wear.
Challenges with Current Electrical Mechanical Relay Architecture
Continuing to rely on Standard SMT EMRs presents three critical barriers to scaling test systems beyond thousands of channels: Density Saturation, The High Cost of Mechanical Lifespan, Control ComplexityToward's Solution
Migrating to the "MOS Relay Module" to efficiently replace EMRs functionality and maximize system density.- Technology Shift: From Physical to Electric - The core advantage lies in the physics change.
- Downsize Comparison Here is a diagram of a previous case where our customer successfully used one of our 2 x 2:4 relay modules to replace two 2 Form C relays of similar spec. The result is roughly 45% space savings with no compromises in functionality.
- Optimization of Control Logic(Voltage vs. Current): Transitioning from Voltage-Driven Coils to Current-Driven LEDs offers fundamental circuit advantages, which Toward has optimized for easy integration.
Spec comparison: Where MOS Relay Modules Are Today — and Where They're Going
While size and reliability are the two primary reasons teams consider migrating from electromechanical relays (EMRs) to MOSFET relays, electrical specifications ultimately determine whether a MOS solution is a drop-in replacement in semiconductor test. EMRs are nearing a practical miniaturization limit—shrinking further without sacrificing key specs is increasingly difficult—while MOSFET relay architectures can scale to much smaller footprints.
That said, solid-state relays (SSRs) with non-moving contacts still fall short of EMRs in certain specs that benefit from physical contacts, depending on the application. The gap is closing quickly, and as channel density and miniaturization become dominant constraints, many test and measurement customers have found MOSFET relays can competently replace a large portion of today's EMR use cases. As mentioned, our first-generation MOSFET module, the CQM series, delivers a ~ 50% size reduction versus comparable EMR modules.
Results
Toward MOS Relay Module is a strategic infrastructure upgrade that transforms ATE systems into highdensity, long-life platforms ready for the future of semiconductor testing.
- Recommendation: Adopt the MOS Relay Module to:
- Recover 50% of PCB space for added resources.
- Eliminate downtime caused by mechanical failures.
- Simplify Circuit Design by removing noise suppression components while retaining 5V drive compatibility.
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Case Study: Toward's High-Density MOSFET Relay Modules
The Pathway to 50% Footprint Reduction & Reduced Maintenance Upgrading from Electrical Mechanical Relays to High-Density MOSFET Relay Modules
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