80 Gbps Differential DP3T RF MEMS Switch | PCIe Gen6 & SerDes Test Switch
MM5627
The MM5627 is an 80 Gbps differential DP3T RF MEMS switch engineered for advanced signal routing and validation in modern high-speed digital systems. Designed to support next-generation interfaces such as PCIe Gen5, PCIe Gen6, and high-speed SerDes links, the device enables reliable switching and loopback of differential signals required in cutting-edge semiconductor test environments.
Built on Menlo Micro's Ideal Switch® technology, the MM5627 provides outstanding signal integrity with low insertion loss, fast switching performance, and a wide 20 GHz bandwidth. Each differential lane can be independently controlled, enabling flexible signal routing and loopback configurations with up to 128 programmable switch states, making it ideal for complex multi-channel test architectures.
As a DC-coupled switching solution, the MM5627 allows engineers to implement external signal-conditioning components tailored to their channel requirements. This flexibility supports optimized impedance control and signal tuning in demanding applications such as AI processor validation, high-speed digital testing, and next-generation semiconductor development.
Key Benefits
Leveraging Menlo Micro’s Ideal Switch® technology, the MM5627 delivers clean and stable DC-coupled differential signal switching across a wide 20 GHz bandwidth while supporting data rates up to 80 Gbps. Independent control of each differential lane enables flexible routing, switching, and loopback configurations across 128 possible switch states, allowing engineers to construct sophisticated validation matrices for high-density test platforms.
With low insertion loss, rapid switching capability, and switching endurance exceeding three billion cycles, the MM5627 ensures consistent and reliable performance in demanding high-speed environments. The DC-coupled design also provides additional flexibility for engineers to optimize signal channels using external capacitors or conditioning components when validating PCIe Gen5/Gen6, SerDes, and other high-speed digital interfaces.
System Integration
The MM5627 utilizes a compact System-in-Package (SiP) architecture that integrates the switch driver and charge pump into a single module, simplifying high-speed board design while reducing overall system complexity. Control is provided through an SPI interface, enabling seamless integration with host processors and automated test controllers.
This architecture supports scalable signal routing and loopback functionality across multiple channels, making the MM5627 well suited for parallel testing in automated test equipment (ATE). The compact design helps minimize PCB footprint while maintaining the performance required for high-density semiconductor test systems and signal-integrity validation platforms.
Features
- Ideal Switch® Technology provided by Menlo Micro
- DC to 20 GHz range
- Dual DP3T configuration with Loopback
- Low insertion loss: 2.3 dB @ 20 GHz
- Integrated charge pump and driver eliminates the requirement for external biasing and driver circuitry
- Fully controllable ports for low, medium, and high data rate signal routing.
- High Reliability: Greater than 3 billion switching operations
- 8.2*8.2 mm LGA Package
- 128 possible switch control states
Contact Form
- Differential, Dual DP3T
Frequency
- DC to 20 GHz
On Resistance (Ω)
- 1.7 Ω (HS to MS/LS, MS to LS), up to 4.0 Ω
- 3.4 Ω (HS to HS, MS to MS, LS to LS), up to 8.0 Ω
Insertion Loss [Differential]
- 2.3 dB @ 20 GHz (HS1 to HS2)
- 1.5 dB @ 16 GHz (HS1 to HS2)
- 2.3 dB @ 16 GHz (MS1 to MS2)
- 0.9 dB @ 16 GHz (HS1 to MS1)
- 1.3 dB @ 16 GHz (HS2 to MS2)
- 2.3 dB @ 16 GHz (HS1 to MS2)
- 1.9 dB @ 16 GHz (MS1 to HS2)
Return Loss [Differential]
- 22 dB @ 20 GHz (HS1 to HS2)
- 27 dB @ 16 GHz (HS1 to HS2)
- 22 dB (MS1 to MS2)
- 45 dB (HS1 to MS1)
- 29 dB (HS2 to MS2)
- 20 dB (HS1 to MS2)
- 21 dB (MS1 to HS2)
Isolation [Differential]
- 48 dB @ 20 GHz (HS1 to HS2)
- 52 dB @ 16 GHz (HS1 to HS2)
- 36 dB @ 16 GHz (MS1 to MS2)
- 41 dB @ 16 GHz (HS1 to MS1)
- 43 dB @ 16 GHz (HS2 to MS2)
- 44 dB @ 16 GHz (HS1 to MS2)
- 64 dB @ 16 GHz (MS1 to HS2)
ESD Protection
- 150 V (RF pins)
- 2000 V (Control/Power pins)
- 500 V (VPP pin)
Application
- High-Speed Data Digital Component Testing
- Optical-Electrical Module Testing
- High-Speed Signal Routing
- ATE Device Interface Boards
- Optical-Electrical Module Testing
- Differential Switch Matrices
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